12th International Symposium on Telecommunication (IST'2026)

Keynote Speakers

Reza Farajidana

University of Tehran

Ahmad Reza Sharafat

Tarbiat Modares University

Jawad A. Salehi

Sharif University of Technology

Prof. Jiancheng An

Presentation Title: 3D Intelligent Metasurfaces

Biography: Jiancheng An (Senior Member, IEEE) received the B.S. degree in Electronics and Information Engineering and the Ph.D. degree in Information and Communication Engineering from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2016 and 2021, respectively. From 2019 to 2020, he was a Visiting Scholar with the Next-Generation Wireless Group, University of Southampton, Southampton, U.K. From 2021 to 2023, he was a Post-Doctoral Research Fellow with the Engineering Product Development (EPD) Pillar, Singapore University of Technology and Design (SUTD), Singapore. From 2023 to 2026, he was a Research Fellow with the School of Electrical and Electronics Engineering, Nanyang Technological University (NTU), Singapore. He is currently a Professor with the School of Electronic Science and Engineering, UESTC, Chengdu, China. Dr. An received the IEEE International Conference on Communications (ICC) 2023 Best Paper Award. He is the co-inventor of six patents and has published over 100 research papers in peer-reviewed international journals and conferences. His research interests include stacked intelligent metasurfaces (SIM), flexible intelligent metasurfaces (FIM), and electromagnetic neural networks (EMNN). Dr. An serves as an Editor for IEEE Transactions on Communications, IEEE Open Journal of the Communications Society, and IEEE Wireless Communications Letters. He is also the Lead Guest Editor for the Special Issue on “Stacked Intelligent Metasurface-Empowered Advanced Signal Processing Paradigm for 6G and Beyond” in IEEE Wireless Communications.

Abstract: Intelligent metasurface technology offers a promising path toward building cost-effective, extremely large-scale antenna arrays and on-demand manipulation of wireless environments. Building on this foundation, two emerging metasurface technologies — Stacked Intelligent Metasurfaces (SIM) and Flexible Intelligent Metasurfaces (FIM) — have achieved significant breakthroughs in functional expansion and deployment versatility. SIM takes an innovative approach by creating a neural network-like structure from multiple layers of programmable metasurfaces. This electromagnetic computing framework can handle signal processing tasks directly in the wave domain, thereby achieving the intelligent utilization of the electromagnetic space. FIM has significantly expanded the deployment and application scope of conventional rigid metasurfaces, enabling them to flexibly adapt to any surface shape. It is particularly worth noting that with the introduction of the electromagnetic drive Lorentz force mechanism, FIM with real-time shape control capabilities can significantly enhance the overall performance of wireless communication and sensing systems. In this talk, we will first elaborate on the basic working principles and key implementation technologies of SIM and FIM. We will then conduct an in-depth analysis of specific application cases of these two technologies in communication and sensing application scenarios, before addressing the primary research challenges and opportunities that need to be tackled for successful deployment of these systems in practice.

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